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When baking MSD, pay attention to the following issues:
Depending on the humidity sensitivity level, size and humidity of the device, the drying process of different MSDs is also different. After drying the device as required, the ShelfLife and FloorLife of the MSD can be calculated from zero.
Generally, devices installed in high-temperature trays (such as high-temperature trays) can be baked at 125℃, unless the manufacturer specifically specifies the temperature. The maximum baking temperature is generally noted on the tray.
The baking temperature of devices installed in low-temperature trays (such as low-temperature trays, tubes, and reels) cannot be higher than 40℃, otherwise the tray will be damaged by high temperature.
Remove the paper/plastic bag/box before baking at 125℃.
Pay attention to ESD (electrostatic sensitivity) protection during baking, especially after baking, the environment is particularly dry and static electricity is most likely to be generated.
Be sure to control the temperature and time during baking. If the temperature is too high or the time is too long, it is easy to oxidize the device, or generate intermetallic compounds at the internal joints of the device, thereby affecting the solderability of the device.
During baking, be careful not to cause the tray to release unknown gases, otherwise it will affect the solderability of the device.
During baking, baking records must be kept to control the baking time.
If the MSD rework needs to remove the device on the motherboard, it is best to use local heating and control the surface temperature of the device within 200℃ to reduce the damage caused by humidity. If the temperature of some devices exceeds 200℃ and exceeds the specified FloorLife, the motherboard must be baked before rework. The baking method is described in the next paragraph; within FloorLife, the temperature that the device can withstand is the same as the temperature that reflow soldering can withstand.
If the device is removed for defect analysis, be sure to follow the above suggestions, otherwise the damage caused by humidity will cover up the original cause of the defect.
If the device is to be recycled and reused after removal, follow the above suggestions even more. MSD cannot replace drying after several reflow soldering or rework
Some SMD devices and motherboards cannot withstand long-term high-temperature baking, such as some FR-4 materials, which cannot withstand 24 hours of 125℃ baking; some batteries and electrolytic capacitors are also very sensitive to temperature. Consider these factors comprehensively and choose the appropriate baking method.
MSD baking precautions~
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